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    • 1. 发明授权
    • Nonvolatile memory device
    • 非易失性存储器件
    • US07525148B2
    • 2009-04-28
    • US11228696
    • 2005-09-16
    • Young-Joon KimDae-Woong KimMin Kim
    • Young-Joon KimDae-Woong KimMin Kim
    • H01L29/76
    • H01L27/115H01L27/11521
    • A nonvolatile memory device and a method of manufacturing the same are provided. An insulation layer having a high etching rate as compared with a pad oxide layer is formed as a buffer layer between a first STI film formed as a lower part of semiconductor substrate and a second STI film formed as an upper part of the semiconductor substrate, to obtain a pillar CD for an SAP structure. The buffer layer is etched more speedily in comparison with the pad oxide layer in a procedure of etching the pad oxide layer, thus ensuring a sufficient pillar CD without an excessive wet etch-back. Accordingly, a defect occurrence such as a grooving or seam can be prevented in realizing the SAP structure, and a tunnel oxide layer can be formed with uniform thickness.
    • 提供了一种非易失性存储器件及其制造方法。 形成与衬垫氧化物层相比具有高蚀刻速率的绝缘层作为形成为半导体衬底的下部的第一STI膜和形成为半导体衬底的上部的第二STI膜之间的缓冲层形成为 获得SAP结构的支柱CD。 在蚀刻衬垫氧化物层的过程中,与衬垫氧化物层相比,缓冲层被更快速地蚀刻,从而确保了足够的支柱CD而没有过多的湿回蚀。 因此,在实现SAP结构时,可以防止诸如切槽或接缝的缺陷发生,并且可以形成具有均匀厚度的隧道氧化物层。
    • 4. 发明申请
    • Fixing pin for model teeth die
    • 型牙模具固定销
    • US20050019723A1
    • 2005-01-27
    • US10658672
    • 2003-09-09
    • Dae-Woong KimWon-Chul Lee
    • Dae-Woong KimWon-Chul Lee
    • A61C9/00A61C13/34A61C19/00
    • A61C9/002
    • Disclosed is a fixing pin for a model teeth die connecting a model teeth die to a model base. The fixing pin includes a model base inserting portion having a side expansion portion and being inserted into the model base, and a die inserting portion being fixedly inserted into the model teeth die. The model base inserting portion is a taper type, and the side expansion portion is a streamline and expands from one side of the model base inserting portion. Further, the die inserting portion is formed on the upper surface of the model base inserting portion neighboring to the side expansion portion. Thereby, when the model teeth die is connected to the model base, it is prevented from being rotated. Further, the fixing pin may be easily manufactured.
    • 公开了一种用于将型号牙模与模型基座连接的模型牙齿模具的固定销。 固定销包括具有侧部膨胀部分并插入到模型基座中的模型基部插入部分,并且模具插入部分固定地插入到模型牙齿模具中。 模型基础插入部分是锥形的,侧面扩张部分是流线并从模型基础插入部分的一侧膨胀。 此外,模具插入部分形成在与侧面扩张部分相邻的模型基部插入部分的上表面上。 因此,当模型齿模连接到模型基座时,防止其旋转。 此外,可以容易地制造固定销。
    • 8. 发明申请
    • Nonvolatile memory device and method for manufacturing the same
    • 非易失性存储器件及其制造方法
    • US20060113610A1
    • 2006-06-01
    • US11228696
    • 2005-09-16
    • Young-Joon KimDae-Woong KimMin Kim
    • Young-Joon KimDae-Woong KimMin Kim
    • H01L29/76
    • H01L27/115H01L27/11521
    • A nonvolatile memory device and a method of manufacturing the same are provided. An insulation layer having a high etching rate as compared with a pad oxide layer is formed as a buffer layer between a first STI film formed as a lower part of semiconductor substrate and a second STI film formed as an upper part of the semiconductor substrate, to obtain a pillar CD for an SAP structure. The buffer layer is etched more speedily in comparison with the pad oxide layer in a procedure of etching the pad oxide layer, thus ensuring a sufficient pillar CD without an excessive wet etch-back. Accordingly, a defect occurrence such as a grooving or seam can be prevented in realizing the SAP structure, and a tunnel oxide layer can be formed with uniform thickness.
    • 提供了一种非易失性存储器件及其制造方法。 形成与衬垫氧化物层相比具有高蚀刻速率的绝缘层作为形成为半导体衬底的下部的第一STI膜和形成为半导体衬底的上部的第二STI膜之间的缓冲层形成为 获得SAP结构的支柱CD。 在蚀刻衬垫氧化物层的过程中,与衬垫氧化物层相比,缓冲层被更快速地蚀刻,从而确保了足够的支柱CD而没有过多的湿回蚀。 因此,在实现SAP结构时,可以防止诸如切槽或接缝的缺陷发生,并且可以形成具有均匀厚度的隧道氧化物层。